Method for probing impact sensitve and thin layered substrate

ABSTRACT

A method of moving a substrate to a probe card. The method comprises moving a probe card and a substrate vertically closer to one another employing dynamically changing velocities during the moving. More than two different velocities are used during the moving. The velocities are at zero only at an initial location and a final location. The moving is such that the probe card and the substrate contact each other with a soft impact. The velocities for the moving begin with a high velocity and reduce to a lower velocity so that the contact between the probe card and the substrate us a microtouch impact.

RELATED APPLICATIONS

This application is a divisional of co-pending U.S. patent applicationSer. No. 11/271,416, filed Nov. 9, 2005, entitled “Method For ProbingImpact Sensitive and Thin Layered Substrate” which is herebyincorporated herein by reference in its entirety.

FIELD

The present invention relates generally to semiconductor processing andmore particularly to a probe card system and a method for probing impactsensitive and thin-layered substrates.

BACKGROUND

Integrated circuits are often manufactured on a semiconductor substrate,such as a silicon wafer. The silicon wafer is typically a thin circularplate of silicon that is 150, 200 or 300 millimeters in diameter andapproximately 25 mils thick. A single wafer will have numerous deviceswhich are integrated circuits and are imprinted on the wafer comprisinga lattice of devices. Each device consists of numerous layers ofcircuitry and a collection of bonding pads. The bonding pads are smallsites, typically 3 mils square, made usually with aluminum (or otherconductive material) that eventually serves as the device's connectionsto the pin leads. Other than the bonding pads, the remainder of thewafer is coated with a final layer of an insulating material such assilicon nitride, called the passivation layer, which in many respectsbehaves like glass. The aluminum itself forms a thin non-conductivelayer of aluminum oxide, which must be eliminated or broken throughbefore good electrical contact can be made.

Since the packaging of a device is somewhat expensive, it is desirableto test a device before packaging to avoid packaging bad devices. Thisprocess of testing devices before packaging is referred to as the sortprocess. This process involves connecting a device called a probe cardto a special tester. The probe card has a collection of electricalcontacts or pins (also referred to as probe elements) that stands in forthe normal pins and wire leads of a packaged device. The wafer is thenpositioned so that the contacts or pins on the probe card make contactwith a given device's bonding pads and the tester runs a battery ofelectrical tests on the device. A special machine, called a waferprober, is used to position each device on the wafer with respect to theprobe card. High accuracy is required, because the bonding pads aresmall and if a probe card pin makes contact outside the bonding padarea, the result may be a break in the passivation layer, whichgenerally results in a damaged device. Also, the card pins need to becleaned to ensure accuracy of such contact.

A primary purpose of wafer probing is to accurately position thecollection of devices, or dice, on a wafer in such a manner so that thedevice's bonding pads make good electrical contact with a probe card'sprobe pins so that the device may be properly tested before dicing andpackaging. Inaccuracy positioning may cause damages to either the probepins or the bonding pads, and/or other components of the probe card andthe devices on the substrate.

Types of damages that may occur include gouging of the bonding pads soas to expose the metal layer underneath and cracking of the pads therebydamaging the active components below. Other damages include damages tothe probe pins such as bending and breaking. To avoid damages such asdamages to the bonding pads, the motions of the probe system arecontrolled so as to achieve a “softer” (e.g., slower and less forceful)contact between the probe pins and the bonding pads. In one currentmethod, the substrate is moved up to a specific height of contact,stopped, and the motion of moving the substrate is changed. The motionis slowed down so that the substrate can be moved closer to the probepins with a reduced motion. In that way, the contact between the bondingpads and the probe pins is softer or slower. Such change of motionsubstantially impacts the probe system's throughput.

It is desirable to provide a probe card cleaning device and method,which overcomes the above limitations and drawbacks of the conventionaltesting devices.

SUMMARY

Embodiments of the present invention provide improved methods for movinga probe card toward a substrate in a probe system for a particularprocedure.

In one aspect, the invention pertains to a method of moving a substrateto a probe card. The method comprises moving a probe card and asubstrate vertically closer to one another employing dynamicallychanging velocities during the moving. More than two differentvelocities are used during the moving. The velocities are at zero onlyat an initial location and a final location. The moving is such that theprobe card and the substrate contact each other with a soft impact. Thevelocities for the moving begin with a high velocity and reduce to alower velocity so that the contact between the probe card and thesubstrate use a microtouch impact.

In another aspect, the invention pertains to a method which comprisesplacing a substrate on a substrate supporter provided in a probe system.The substrate supporter is moveable in XYZ directions. Next, a probecard coupled to a probe chuck of the probe system is provided. The probecard has at least one probe pin configured to perform a procedure on thesubstrate. The probe card is also moveable in XYZ directions. Next, theprobe chuck and the substrate supporter are moved in the Z-directiontoward one another using dynamically changing velocities. During themoving, a plurality of different velocities are used and the velocitiesare at zero only at an initial location and a final location of theprobe card and the substrate. The method further includes moving theprobe card and/or the substrate in the Z-direction a fast velocitybefore the probe card and the substrate contact each other and at a slowvelocity as the probe card and the substrate contact each otherproducing a microtouch impact.

In another aspect, the invention pertains to a method which comprisesobtaining a first characteristic associated with a substrate loaded on asubstrate supporter and a second characteristic associated with a probecard loaded on a probe card supporter. Next, determine a set ofvelocities and a sequence of velocities for moving the substratesupporter and the probe card supporter toward each other based on thefirst characteristic and the second characteristic to cause a contactbetween the probe card and the substrate. The velocities including oneor more fast velocities and one or more slower velocities with respectto the fast velocities. The velocities provides for a fast moving of theprobe card and/or the substrate toward each other and a slow moving ofthe probe card and/or the substrate into contact with a microtouchimpact between the probe card and said substrate. Next, execute a seriesof motions to carry out the moving.

More details of the embodiments of the present invention are followed.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be understood more fully from the detaileddescription given below and from the accompanying drawings of variousembodiments of the invention, which, however, should not be taken tolimit the invention to the specific embodiments, but are for explanationand understanding only. In the drawings:

FIG. 1 illustrates an example wafer prober system;

FIG. 2 illustrates another exemplary embodiment of a probe system;

FIGS. 3-4 illustrate exemplary embodiment of a scrub pad that can beused with various embodiments of the present invention;

FIGS. 5-6 illustrate a motion profile of moving a substrate to contact aprobe card; and

FIGS. 7A-7C illustrate exemplary motion profiles that can be used tomove a substrate and a probe card closer to contact one another with amicrotouch impact; and

FIG. 8 illustrates an exemplary method of moving a probe card and asubstrate closer to one another according to some embodiments of thepresent invention.

DETAILED DESCRIPTION

In the following description, for purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of the invention. It will be apparent t one skilled in theart, however, that the invention can be practiced without these specificdetails. In other instances, structures and devices are shown in blockdiagram form to avoid obscuring the invention.

Prior to describing exemplary methods of the present invention thatpertain to moving a probe card and a substrate closer to and contacteach other with a microtouch impact a short description of an exemplaryprobe system is provided. An exemplary probe system that can benefitfrom embodiments of the present invention is described below. The probesystem below is only an example of a probe system that can be used withthe present invention. It is to be understood that other systems canalso be used in conjunction with embodiments of the present inventionand likewise benefit from the invention. Although the discussion of theexemplary embodiments focus mainly on a probe system, the embodimentsare similarly applicable for other system where two surfaces (orcomponents thereon) need to come into contact with each other with amicrotouch impact, an impact where the surfaces or components contacteach other smoothly and softly without an excessive force that may causedamages.

FIG. 1 of the accompanying drawings illustrates a probe apparatus 100,according to an embodiment of the present invention, for an electricaltesting of a substrate (e.g., a silicon wafer) having a plurality ofterminals. The apparatus 100 includes a frame 101, a probe card 130, asubstrate holder 102, a scrub device 152, and a translation device 110.

The frame 101 includes an opening 116 through which the probe card 130is introduced into the frame 101. The frame 101 also can define atesting and cleaning chamber 103 for the apparatus 100. The chamber 103can be set to a suitable condition (e.g., suitable temperature andpressure) for the testing and cleaning a wafer.

The probe card 130 is mounted to a probe card support structure 140,which is further mounted or extended from a probe card chuck 142. Thechuck 142 actuates, manipulates, positions, or controls the position ofthe probe card 130. The chuck 142 can be connected to an arm 143 that iscoupled to or is part of a motor that is used to move actuate,manipulate, position, or align the probe card 130. The probe chuck 142may be configured to provide movements of the probe card 130 in any ofthe X, Y, Z, and theta directions 199. In addition, the movements of theprobe card 130 can also be controlled by a processing unit or acontroller 120 provided with or coupled to the apparatus 100. Thecontroller 120 is typically a computer or a machine having a processor(not shown) that can execute a program (a set of instructions) thatcontrols all of the components of and steps associated with theapparatus 100. In one embodiment, a computer program product is storedin a machine-readable medium (not shown) or a memory storage medium thatcommunicates with the controller 120 and is executed by the processor.In this embodiment, the program controls movements of the probe cardsupporter, the substrate supporter, a testing cycle, cleaning cycle, andother steps associated with the apparatus 100. User interactive devicessuch as keyboard, mouse, and display (not shown) can also be coupled tothe controller 120 to allow for controlling of the apparatus 100.

The probe card 130 includes a plurality of probe elements, pins, or bars132 extending from the bottom surface of the probe card 130. Theelements 132 are contact electrodes which may include metallic pins. Theprobe elements 132 are also secured to the probe card 130. The probecard 130 is used for making electrical contact with terminals (contactpads) 114 on a substrate 112. The probe elements 132 are brought intocontact with the terminals 114. An electrical tester (not shown) isconnected to the probe elements 132 and the probe card 130. Electricalsignals can be transmitted from the electrical tester thorough the probeelements and the terminals to the electrical circuits, or signals can besent from the circuits through the terminals and probe elements to theelectrical tester. The probe card 130 may be any of the differentvarieties of probe cards, including for example membrane probe cards.

The substrate holder 102 is mounted or supported by a wafer chuck 106which is further coupled to a base 104. In one embodiment, the base 104is located on a horizontal surface of the frame 103. The base 104 isconfigured to translate a force to the wafer chuck 106 to allow it tomove in a vertical and/or horizontal direction. In one embodiment, waferchuck 106 is moveably coupled to the base 104 in a manner which allowsthe wafer chuck 106 to be moved in the X, Y, Z, and theta directions199. The base 104 can include a motor or an actuation mechanism 103(known in the art) to move the wafer chuck 106 in the X, Y, Z, and thetadirections.

The wafer chuck 106 also accepts the attachment of a substrate 112 viathe substrate support 102. The substrate 112 is a semiconductor waferhaving one or more electrical components (not shown) built or formedthereon or therein. Contact pads (terminals) 114 are provided on thesubstrate 112 for a testing purpose, in one embodiment.

The wafer chuck 106 and the base 104 can also be coupled to thecontroller 120 similar to previously described for the probe cardsupport structure 140 and the probe card chuck 142. In addition, themovement of the wafer chuck 106, the base 104, as well as the substratesupport 102 can also be controlled by the controller 120 coupled to theapparatus 100.

For a testing cycle, the probe card 130 is brought into contact with thesubstrate 112 such that the probe elements 132 make contact with thecontact pads 114 on the substrate so that a particular electricaltesting can take place. For instance, the elements 132 make contact withthe pads 114 of the substrate 112 when the probe card 130 and thesubstrate 112 are properly aligned and brought sufficiently close toeach other by the apparatus 100, for example, via the assistance of anoperator and/or the controller 120. The pads 114 may comprise anycontact electrode surface including, but not limited to a flat surfaceor a solder bump or pins or posts. The probe card 130 and the substrate112 contact one another with a “microtouch” impact, in that the probecard 130 and the substrate 112 sufficiently contact each other to allowfor the connection between the elements 132 and the pads 114 without toomuch force or too much impact that may cause damages to the probeelements 132, the pads 114, or other elements of the substrate 112and/or the probe card 130, In according to embodiments of the presentinvention, the probe card 130 and the substrate 112 are brought intocontact with a microtouch impact by using a set of velocities where onlythe initial velocity and the final velocity are at zero and thevelocities during the moving are changing from fast to slow to preventexcessive impact. More details on controlling the velocities aredescribed in more details below.

The alignment for the probe card 130 with respect to the substrate 112can also be accomplished using a vision subsystem (not shown)incorporated into the apparatus 100 and positioned in the chamber 103.The vision subsystem of the apparatus 100 of the present embodiment mayuse two cameras, a wafer alignment camera (not shown) and a sensorcamera (not shown). The wafer alignment camera, which may contain bothcoaxial and oblique illumination sources, is configured to view asubstrate 112 on the wafer chuck 102. The vision subsystem is alsoconfigured to view a probe card 130 attached to the probe chuck 140.

While the system shown in FIG. 1 probes the wafer horizontally, it willbe appreciated that the various aspects of the present invention may beused with vertical prober system in which the flat surface of the waferis rotated 90-degree from the position shown in FIG. 1. Also, althoughthe apparatus 100 shown in this figure illustrates only one probe card130 and one substrate 112, it is to be understood that the apparatus 100may very well include more than one of such components.

After a certain testing cycles, the probe elements 132 may need to becleaned or otherwise treated. A scrub device 152 is provided for suchcleaning or treating purpose. The scrub device 152 may be includedwithin the chamber 103 as shown in FIG. 1. In one embodiment, the scrubdevice 152 is placed on scrub supporter 150 and can be moved in the X,Y, and Z direction 199. The scrub device 152 includes a scrub substrateor pad 154 placed on top of the scrub device 152. The scrub supporter150 can be moved by the base 104 similarly to how the wafer chuck 106 ismoved. A motor similar to the motor 103 may be included in the base 104to move the scrub supporter 150. The scrub device 152 is aligned withthe probe card 130 for cleaning. The scrub device 152 is movedvertically upward in the D₁₀₀ direction so that the scrub pad 154 is ata higher position than the substrate 112; for instance, the scrub device152 is raised a distance 156 so as to place the scrub device 152 to behigher than the substrate 112. In one embodiment, a motor (not shown) iscoupled to the scrub device 152 to move the scrub device 152 in thevertical direction (Z direction) so that the scrub pad 154 can bebrought closer to the probe elements 132. The motor can also beconfigured to be able to rotate the scrub device 152 for a particularcleaning process. Alternatively, the motor that is used to control theprobe card 130 can also be configured to rotate the probe card 130 forsimilar cleaning processes.

The scrub pad 154 can be made of various materials that can clean aprobe element 132 of a probe card 130. In cleaning the probe element132, the scrub pad 154 can scrub, clean, maintain, reshape, sharpen, oreven modify the probe element 132 depending on a desired cleaningprocess. The scrub pad 154 may also have a predetermined mechanical orchemical characteristic such as abrasiveness, density, elasticity,tackiness, planarity, and chemical properties (acetic or basic).

In one embodiment, the scrub pad 154 includes a chemical layer or layersor a gel-like material for a particular cleaning process. FIGS. 3-4illustrate an exemplary scrub pad 300 that can be used for the scrub pad154. In the present embodiment, the scrub pad 300 includes a frame 302that surrounds a cleaning stack 304. The cleaning stack 304 includes oneor more chemical layers or cells that may be acetic or basic which canoxidize, reduce, or clean contaminants, or which can induce a chemicalreaction and/or a mechanical action that removes contaminants. FIG. 4illustrates an exemplary cleaning stack 304 in more detail. The stack304 includes a substrate 306, a layer 310 disposed on the layer 309, anda layer 312 disposed on the layer 310. Between each layer, there may bea seal layer 314 and 316. Each of the layers 308, 310, and 312 may be achemical layer having a particular characteristic for a particularcleaning. The stack 304 may include a combination of layer that performsboth chemical and mechanical cleaning for a probe element. The scrub pad300 can include materials such as tungsten, ceramic, aluminum, stainlesssteel, gel pad, sand paper, etc. More details of the apparatus 100 canbe found in a co-pending patent application entitled “Method andapparatus for cleaning a probe card,” which has a Ser. No. 11/195,926,which is hereby incorporated by reference in its entirety.

FIG. 2 illustrates yet another exemplary probe apparatus 200 that can beused for or benefit from embodiments of the present invention. Theapparatus 200 is similar to the apparatus 100 except that in theapparatus 200, the scrub device is attached to a platform that supportsthe substrate and that the apparatus 200 utilizes a mechanism that isused to move the substrate in alignment with the probe card for testingto move a scrub device in alignment with the probe card for cleaning theprobe elements.

The apparatus 200 includes a frame 220, a probe card 230, a substrateholder or supporter 202, a scrub pad mounting plate/platform 210, and atranslation device 201. The frame 220 includes an opening 203 throughwhich the probe card 230 is introduced into the chamber 205 of theapparatus 200.

The probe card 230 is mounted to a probe card support structure 240,which is further mounted or extended from a probe card chuck 242. Thechuck 242 actuates, manipulates, positions, or controls the position ofthe probe card 230. The chuck 242 can be connected to an arm that iscoupled to or is part of a motor that is used to move, actuate,manipulate, position, or align the probe card 230. The probe chuck 242may be configured to provide movement of the probe card 230 in any ofthe X, Y, Z, and theta directions 299. In addition, the movement of theprobe card 230 can also be controlled by a processing unit or acontroller 221 coupled to the apparatus 200 (similar to the controller120 for the apparatus 100).

The probe card 230 includes a plurality of probe elements, pins, or bars232 extending from the bottom surface of the probe card 230. The probeelements 232 are brought into contact with terminals 209 provided on asubstrate 212 for a particular testing.

The substrate holder 212 is controlled by the translational device 201.In one embodiment, the substrate holder 212 is mounted to a platform 202which is further supported by a wafer chuck 206 which is further coupledto a base 204. In one embodiment, the base 204 is located on ahorizontal surface of the frame 220. The base 204 is configured totranslate a force to the wafer chuck 206 to allow it to move in avertical and/or horizontal direction. In one embodiment, wafer chuck 206is moveably coupled to the base 204 in a manner which allows the waferchuck 206 to be moved in the X, Y, Z, and theta directions 299. The base204 can include a motor or an actuation mechanism 203 (known in the art)to move the wafer chuck in the X, Y, Z, and theta directions. Moving ofthe wafer chuck 206 translates respective movement to the platform 202and the substrate holder 212.

The wafer chuck 206 also accepts the attachment of a substrate 208 viathe substrate support 212. The substrate 208 is a semiconductor waferhaving one or more electrical components (not shown) built or formedthereon or therein. Contact pads 209 are provided on the substrate 208for a testing purpose, in one embodiment.

The wafer chuck 206 and the base 204 can also be coupled to thecontroller 221 similar to previously described for the probe cardsupport structure 240 and the probe card chuck 242. In addition, themovement of the wafer chuck 206, the base 204, the platform 202, as wellas the substrate support 202 can also be controlled by the controller220 coupled to the apparatus 200.

The elements 232 make contact with the pads 209 of the substrate 208when the probe card 230 and the substrate 208 are properly aligned bythe apparatus 200, for example, via the assistance of an operator and/orthe controller 221. The alignment can also be accomplished using avision subsystem (not shown) incorporated into the apparatus 200 andpositioned in the chamber 220. The vision subsystem of the apparatus 200of the present embodiment may use two cameras: a wafer alignment camera(not shown) and a sensor camera (not shown). The wafer alignment camera,which may contain both coaxial and oblique illumination sources, isconfigured to view a substrate 208 on the substrate supporter 212. Thevision subsystem is also configured to view a probe card 230 attached tothe probe chuck 240.

The scrub pad mounting plate 210 is also controlled by the translationaldevice 201. The scrub pad mounting plate 210 is mounted on the platform202. In one embodiment, the scrub pad mounting plate 210 is coupled tothe wafer chuck 206 (via the platform 202) so that the chuck 206 canmove the scrub pad mounting plate 210 in the same way that the waferchuck 206 moves the substrate supporter 212. In one embodiment, thescrub pad mounting plate 210 is attached to and adjacent to thesubstrate supporter 212. Thus, the same action that is used to move thesubstrate supporter 212 is used to move the scrub pad mounting plate210. In the present embodiment, only one actuation mechanism is used tomove both the substrate supporter 212 and the scrub pad mounting plate210.

The scrub pad mounting plate 210 includes one or more coupling member ormounting member 214 for securing a scrub pad 216A to the scrub padmounting plate 210. The mounting member 214 can have the form of a trackwhere complimentary track on the scrub pad 216A can mount to and besecured thereto.

The scrub pad 216A and the scrub pad mounting plate 210 are dimensionedso that when the scrub pad 216A is mounted onto the scrub pad mountingplate 210, the scrub pad 216A is higher than the substrate 208 that isloaded on the substrate supporter 212. When mounted, the scrub pad 216Ahas a distance D₂₀₀ that is higher than the substrate 208 that ismounted on the substrate supporter 212. The wafer chuck 206 moves boththe scrub pad mounting plate 210 and the scrub pad 216A using the samemechanism but with the scrub pad 216A being dimensioned to besufficiently thick, when loaded, the scrub pad 216A is higher than thesubstrate 208 by the distance D₂₀₀. Thus, the same mechanism is used toraise the substrate supporter 212 and the scrub pad mounting plate 210at the same time but with the scrub pad 216A ends up being higher thanthe substrate due to its thickness. The scrub pad 216A thus can bebrought closer to the probe card for cleaning the probe elements withoutan additional actuation mechanism.

In one embodiment, the scrub pad mounting plate 210 is configured toallow loading/unloading of a new scrub pad. In one embodiment, theapparatus 200 includes a loading/unloading station 231 that holds one ormore scrub pads 216A-216G. The station 231 can be a cassette systemconfigured to store a plurality of scrub pads. The station 231 can alsobe a docking station with compartments or slots configured to hold aplurality of scrub pads. The loading/unloading station 231 can also beconfigured to load a scrub pad onto the scrub pad mounting plate 210. Inone embodiment, the loading/unloading station 231 removes one scrub padfrom the scrub pad mounting plate 210 and places another scrub pad ontothe scrub pad mounting plate 210 (e.g., replacing a used scrub pad witha new scrub pad).

In one embodiment, the loading/unloading station 231 is configured tostore a set of scrub pad 216A-216G of multiple scrub pad materials ofsame types of different types. A used scrub pad can be replaced by anunused pad at the loading/unloading station. The apparatus 200 can alsoload a different scrub pad depending on a particular cleaning processwithout shutting down the apparatus 200 for the replacement. In oneembodiment, the loading/unloading station 231 is configured to storescrub pads of different sizes thus, the apparatus 200 can alsoconveniently load different size probe card and different size scrub padaccordingly without shutting down the apparatus 200 to replace the scrubpad.

The loading/unloading station 231 may be configured to identify thetypes of scrub pad being stored at the loading/unloading station 231.This ability enables cleaning cycle recipe or parameter changesdepending on the identified characteristics of the particular scrub pad.

In one embodiment, the loading/unloading station 231 is mounted on atrack 218 that allows for the station 231 to be moved around. A motor(not shown) may be coupled to the apparatus 200 to control the movementof the station 231. The controller 221 can also be coupled to the motor,the station 231, or the track 218 to execute the movement of the station231. In one embodiment, the station 231 is moved closed to the scrub padmounting plate 210 for the loading and unloading of a scrub pad. Inother embodiments, the base 204 moves the platform 202 and the scrub padmounting plate 210 over to the station 231 for the loading and unloadingof a scrub pad.

In one embodiment, the apparatus 200 includes a robotic assembly 234with a handle 233. The robotic assembly 234 may be coupled to thestation 231 and configured to move together with the station 231. Uponcommand, the robotic assembly 234 (via the handle 233) moves a scrub padfrom the station 231 and loads it onto the scrub pad mounting plate 210.Similarly, the robotic assembly 234 also removes a scrub pad form thescrub pad mounting plate 210, places it into the station 231 andoptionally, loads another scrub pad onto the scrub pad mounting plate210. In one embodiment, the robotic assembly includes a motor (notshown) that allows it to move closer to the scrub pad mounting plate 210to load and unload a scrub pad. Thus, both the scrub pad mounting plate210 and the loading/unloading station 231 need not be moving for loadingand unloading a scrub pad and only the robotic assembly 234 needs tomove for such loading and unloading. Each of the scrub pads 216A-216Gcan be similar to the scrub pad 300 previously described. More detailsof the apparatus 200 can also be found in the previously referenced andincorporated application Ser. No. 11/195,926.

It is to be appreciated that the apparatus 100 may also be configured toinclude a similar loading/unloading station to the station 230 althoughit is not shown in FIG. 1. Additionally, although apparatuses 100 and200 are described, it is to be understood that embodiments of thepresent invention can be similarly applied to other probe systems.

FIGS. 5-6 illustrate exemplary motion profiles used by current methodsto move a substrate closer to a probe card for a particular procedure ortesting. To avoid damages to the probe card, probe pins, substrate,devices on the substrate, and/or other elements of the probe card andsubstrate, motion parameters used to move the substrate closer to theprobe card are adjusted and changed to achieve a softer contact. Currentmethods include moving the substrate up to specific heights of contactbut not physical contact and change the motion parameter (slowervelocity) and continue moving further up toward the height with thereduced motion parameter and move down in the reverse sequences. Asillustrated in FIGS. 5-6, over a course of time (T) for moving asubstrate 12 loaded on a substrate chuck 10 to a probe card 20 havingprobe pins 22, several velocities are employed. Initially, the substrate12 begins with an initial velocity of zero, V₀ and at a height H₀. Thesubstrate 12 is moved to a height H₁₀₀ with a fast velocity or fullspeed V₁₀₀, then is stopped for a duration of T₁₀₀. During the timeT₁₀₀, the velocity is adjusted. The velocity is also dropped to zero,V₀, during the time T₁₀₀. The motion for the substrate 12 is thenchanged to a new velocity parameter V₂₀₀, which is slower than the V₁₀₀.The substrate 12 moves up to a second height H₂₀₀ from the first heightH₁₀₀ at the velocity V₂₀₀. The substrate 12 is then again stopped for aduration of T₂₀₀. During the time T₂₀₀, the velocity is adjusted. Thevelocity is dropped to zero, V₀, during the time T₂₀₀. The motion forthe substrate 12 is then changed to yet another new velocity parameterV₃₀₀, which is slower than the V₁₀₀ and V₂₀₀. The velocity V₃₀₀ shouldbe one that will allow the substrate 12 to touch the probe card 20 witha soft touch to prevent damages. The substrate 12 moves a third heightH₃₀₀ from the height H₂₀₀ at the velocity V₃₀₀ where the probe pins 22can contact certain necessary components on the substrate 12 for aparticular procedure. The current methods suffer a substantial impact onthe motion time, which impacts the system's throughput due to thestopping, adjusting, and resetting velocity at one or more intermediateheights and moving to the final height.

Embodiments of the present invention describe a method to move asubstrate and a probe card closer to each other with a microtouch impact(soft, smooth, and controlled touch without potentially causing bendingor other kind of damages to components) and with motions that are varied“on the fly” without the need to move to a specific height, stop, andchange velocity. Motions are varied on the fly when the motions arechanging form one velocity to another velocity without a stop or withoutusing a velocity of zero. The velocities (or accelerations) of themoving components are thus dynamically changing (changing continuously)and until the final position (impact) is achieved, the velocity is notat zero. The velocities or the motion parameters for moving a substrateand a probe card closer to each other are configured using continuouslychanging (dynamically changing) motions. For a particular substrate andprobe card, information such as thickness, materials, and densitycharacteristics are obtained and used to configure a particular motionprofile. The motion profile includes a sequence of velocities that willbe used to move such substrate and probe card closer and into contactwith each other. The motion profile can be programmed into a controllerprovided to run the probe system, which can then execute the motionsprofile to bring the substrate and probe card into contact with eachother. The methods of moving the substrate and the probe card closer toeach other according to the embodiments of the present invention changethe rate of force or impact as the substrate contacts the probe card.The motion profile has initial velocities being fast and full speed andreduced on the fly to slower velocities and slower velocities forimpact. Such motion profile reduces the impact with which the probeelements initially contact the substrate elements without sacrificingthroughput.

In one embodiment, the substrate is moved toward a stationary probe cardwith a full (fast) speed and the velocity of the moving substrate ischanged or reduced so that the substrate approaches the probe cardslower to allow the microtouch impact. The velocities are constantlymonitored and changed according to the position of the substraterelative to the probe card. It is to be understood that in otherembodiments, the substrate may be stationary instead and the probe cardmoves toward the substrate with similar constantly monitored andchanging velocities.

In one embodiment, the positions of the probe card supporter and thesubstrate supporter in a probe system are determined so that thevelocities can be continuously monitored and changed as the probe cardand the substrate are brought closer to one another. The initial anddesired final positions and positions during moving are also monitoredor determined. For instance, with respect to the apparatus 100 or 200,the initial positions for the probe card (130 or 230) and the substrate(112 or 208) are determined so that when the substrate is moved up tothe probe card (or the probe card moving down to the substrate) thesequence of velocities for the moving can be configured, implemented,and the velocities are monitored and varied continuously to provide themicrotouch impact. The velocities of the motions for moving the probecard or the substrate (or the probe card) from an initial location to afinal location for a microtouch impact between the substrate and theprobe card are continuously monitored and changed until the desiredimpact is achieved.

In one embodiment, a probe card and a substrate are moved verticallycloser to one another using continuous or dynamically changingvelocities from fast to slow to prevent excessive force on impact. Thevelocities are changing as the probe card and/or the substrate is movingso that the velocities are only at zero at an initial location (probecard and substrate apart) and a final location (probe card and substratecontact each other). The velocities for the moving may be updatedfrequently, such as at least every 40-60 microseconds. The duration ofthe updates depends on the locations (initial and final) of thesubstrate and the probe card.

FIGS. 7A-7C illustrate exemplary motion profiles that can be implementedinto a probe system to move a substrate and a probe card into contactwith one another with a microtouch impact. In FIG. 7A, the velocitybegin from V₀ and increases to V_(fast) to begin moving either thesubstrate toward the probe card, the probe card toward the substrate, orboth the probe card and substrate toward one another. Under V_(fast),the probe card and substrate are not yet at the locations to contacteach other. To decrease the impact force, the velocity decreases fromV_(fast) to V_(medium), and decreases further to V_(slow1) and V_(slow2)until V₀, which is the point where a contact occurs. Until the contactpoint, the velocity of the moving component is not at zero. Although notshow, a similar motion profile can be used to bring the substrate and/orthe probe card back to their initial location. Additionally, it may bethat only one velocity is needed to bring the components back to theirinitial location after the contact and a particular procedure ortesting. The actual values of the velocities may vary depending oninformation of the probe system, the initial locations, the desiredfinal locations, and other characteristics of the probe card and thesubstrate. Such information is taken into account when the sequence ofvelocities is being configured for the moving. As mentioned, thesequence of velocities can be programmed into the probe system in orderto execute the moving.

In FIG. 7B, the velocity begin from V₀ and increases to V₃₀₀ to beginmoving either the substrate toward the probe card, the probe card towardthe substrate, or both the probe card and substrate toward one another.The velocity V₃₀₀ is typically a fast speed used to move the probe cardand substrate toward one another but not to allowed them contact eachother. To decrease the impact force, the velocity changes (decreases)from V₃₀₀ to V₃₂₀, and adjusts further to V₃₃₀ until V₀, which is thepoint where a contact occurs. Until the contact point, the velocity ofthe moving component is not at zero. As before, a similar motion profilecan be used to bring the substrate and/or the probe card back to theirinitial location. Additionally, it may be that only one velocity isneeded to bring the components back to their initial location after thecontact and a particular procedure or testing. The actual values of thevelocities may vary depending on information of the probe system, theinitial locations, the desired final locations, and othercharacteristics of the probe card and the substrate. Such information istaken into account when the sequence of velocities is being configuredfor the moving. As mentioned, the sequence of velocities can beprogrammed into the probe system in order to execute the moving.

In FIG. 7C, the velocity begin from V₀, increases to V₄₀₀, increasesfurther to V₄₂₀, and changes to V₄₄₀ to begin moving either thesubstrate toward the probe card, the probe card toward the substrate, orboth the probe card and substrate toward one another. Under V₄₀₀-V₄₄₀,the probe card and substrate are not yet at the locations to contacteach other. To decrease the impact force, the velocity decreases fromV₄₄₀ to V₄₆₀, and may decrease further until V₀, which is the pointwhere a contact occurs. Until the contact point, the velocity of themoving component is not at zero. As before, a similar motion profile canbe used to bring the substrate and/or the probe card back to theirinitial location. Additionally, it may be that only one velocity isneeded to bring the components back to their initial location after thecontact and a particular procedure or testing. The actual values of thevelocities may vary depending on information of the probe system, theinitial locations, the desired final locations, and othercharacteristics of the probe card and the substrate. Such information istaken into account when the sequence of velocities is being configuredfor the moving. As mentioned, the sequence of velocities can beprogrammed into the probe system in order to execute the moving.

FIG. 8 illustrates an exemplary method 700 of moving a probe card andsubstrate closer to one another to create a microtouch impact for aparticular testing. At 702, a probe card's characteristic(s) aredetermined. The probe card characteristics include at least the probecard material, thickness, composition, length of the probe pins thatwill penetrate a layer on a substrate, thickness of the probe pins, andlocation of the probe card in a probe system. The probe cardcharacteristics constitute one or more attributes that are considered inconfiguring a sequence of velocities for moving the probe card andsubstrate into contact. At 704, a substrate's characteristic(s) aredetermined. The substrate characteristics include at least the substratematerial, thickness, composition, length and/or width of the substrate'scontact pads, thickness of the contact pads, thickness and material of alayer that the probe pins can penetrate, material and thickness of alayer that cannot be disturbed, and location of the substrate in a probesystem. The initial locations and desired final locations of the probecard, the substrate, as well as the supporters for the probe card andthe substrate are also determined so as to determine the sequence ofvelocities to move the probe card and the substrate into contact.

An auto alignment system and/or a visualization system may be providedin a probe system to facilitate the determination of the location orposition of the probe card and the substrate relative to one another.For instance, the visualization or the alignment system may beconfigured to locate a known position on the substrate relative to aknown position on a motor used to move the substrate supporter in orderto control the motions of the substrate supporter thus, the position ofthe substrate. The probe system is configured to align the probe card tothe substrate in a way to align the probe pins to the contact pads onthe substrate. The probe system is programmed to know the contact heightof the probe card relative to the substrate. The alignment can becontrolled by a controller provided for the probe card system as isknown in the art.

At 706 and 708, the necessary velocities and sequence of velocities aredetermined (706) and programmed into the probe system (708) so that theprobe card and the substrate can be moved toward each other to a finalmicrotouch impact. The velocities used to move the probe card and thesubstrate toward each other are constantly monitored and changed on thefly. During the moving, the velocity does not remain at zero. In oneembodiment, a sequence of velocities are predetermined based on thecharacteristics of the probe card and the substrate. The velocities areselected so that either the probe card is moved toward a staticsubstrate or a substrate is moved toward a static probe card withvarious different velocities. In one embodiment, at the initial takeoff, the probe card is moved (via the probe card supporter) toward thestatic substrate (loaded on the substrate supporter) beginning with afull speed/fast velocity, then the motion is modified depending on howfar the probe card is to the substrate. The velocity is then reduced toa slower velocity but not reduced to a zero velocity so that when theprobe card comes into contact with the substrate, the impact is soft andsmooth to create a microtouch impact. Only when the impact occurs is thevelocity at zero. At 710, the instructions are execute to carry out themotions for the probe system to move the probe card and the substrateinto contact. The velocity sequence is then used to dictate the movingso that the contact is a microtouch impact.

In one embodiment, a processing unit or a controller (e.g., controller120 or 221, FIGS. 1-2) is configured to execute a set of instructionsthat can carry out the moving with a pre-selected sequence ofvelocities.

While the invention has been described in terms of several embodiments,those of ordinary skill in the art will recognize that the invention isnot limited to the embodiments described. The method and apparatus ofthe invention, but can be practiced with modification and alterationwithin the spirit and scope of the appended claims. The description isthus to be regarded as illustrative instead of limiting.

Having disclosed exempla embodiments, modifications and variations maybe made to the disclosed embodiments while remaining within the spiritand scope of the invention as defined by the appended claims.

1. A method for testing an electrical device comprising: moving a firststructure and a substrate vertically closer to one another employingdynamically changing velocities during said moving, wherein more thantwo different velocities are used during said moving, and whereinvelocities are at zero only at an initial location and a final location,wherein said moving is such that said first structure and said substratecontact each other with a soft impact.
 2. The method of claim 1 whereinsaid velocities are varied continuously such that motions for saidmoving are continuous until the final location.
 3. The method of claim 1wherein parameters for varying said velocities are updated at leastevery 60 microsecond.
 4. A method comprising: placing a substrate on asubstrate supporter provided in a cleaning chamber, said substratesupporter moveable in XYZ directions; providing a first structurecoupled to a chuck, said first structure having at least one componentconfigured to perform a procedure on said substrate, said firststructure being moveable in XYZ directions; moving said first structureand said substrate supporter in the Z-direction toward one another usingdynamically changing velocities during said moving, wherein a pluralityof different velocities are used during said moving, wherein velocitiesare at zero only at an initial location and a final location, whereinsaid moving further includes moving said first structure and saidsubstrate in the Z-direction toward one another at a fast velocitybefore said first structure and said substrate contact each other andimpact at a slow velocity as said first structure and said substratecontact each other producing a microtouch impact.
 5. The method of claim4 wherein moving said first structure and said substrate toward oneanother further comprising: moving said substrate supporter in theZ-direction toward said first structure using the initial velocity ofzero, a second velocity, a third velocity, and the final velocity ofzero without stopping until a desired contact is achieved between saidfirst structure and said substrate.
 6. The method of claim 5 whereinsaid second velocity is faster than said third velocity.
 7. The methodof claim 6 further comprising: returning said substrate supporter to aninitial position.
 8. The method of claim 4 wherein moving said firststructure and said substrate supporter toward one another furthercomprising: moving said first structure toward said substrate supporterusing an initial velocity of zero, a second velocity, a third velocity,and a final velocity of zero without stopping until a desired contactbetween said first structure and said substrate is achieved.
 9. Themethod of claim 8 wherein said second velocity is greater than saidthird velocity.